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(St. Jude Reference #)
|Flexible Multilayer Circuit Board (SJ-00-0035)|
|Description||This invention addresses the problem of limited interconnection space commonly encountered while assembling compact electronic devices. The size of a circuit board is determined primarily by the conductor density and the minimum space required for interconnection with other components. This invention transforms two-dimensional routing of conductors, associated with rigid circuit boards, into a three-dimensional geometry with the use of folded flexible circuits, thereby significantly minimizing the area needed to route conductors. Thus one achieves a structured routing of high-density interconnection conductors between multiple components at a higher density and lower cost than rigid multilayer boards. A demonstration model of this invention is available at St. Jude for those who are interested.|
|Keywords||Electronics, circuit board|
|Granted Patents or Published Applications||U.S. Patent Nos. 6,483,713 and 6,668,447|
|Licensing Opportunities||We are currently seeking licensing opportunities in all fields for the development of this technology.|
Contact the Office of Technology Licensing (Phone: 901-595-2342, Fax: 901-595-3148) for more information.
Last update: September 2008